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Size: 4x4x0.34cm/1.57x1.57x0.13inch
Product structure and composition
Single-layer double-sided ceramic packaging structure
The package is 704 silica gelInside is a semiconductor material made of bismuth telluride (Bi2Te3)
Soldering agent is low temperature solder (Tin-Bismuth Alloy)
100% new and high quality.
Colour:White
Material:Bismuth telluride
Package Contents:
2 x SP1848-27145 Peltier TEG Module
Only the above package content, other products are not included.
Note: Light and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.
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