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BGA Reballing Stencils, Universal BGA Stencils with Fast Tin Implantation, Stainless Steel Reballing Stencils Templates 0.3 0.35 0.4 0.5 for Cellphones

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$5.98

$ 2 .99 $2.99

In Stock
  • HIGH PERFORMANCE: Tin mesh solder template is precisely positioned for fast tin implantation, and the ball template will not change under high temperature.
  • FOUR PITCHES: Universal BGA reballing stencils have three types of holes with 0.3 0.35 0.4 0.5 pitch, four kinds of spacing and multiple sizes.
  • WIDE APPLICATIONS: Universal BGA reballing stencils are versatile and suitable for the common IC used in cell phones today, which can meet your various needs.
  • PREMIUM MATERIAL: This universal Tin mesh solder template is made of premium stainless steel material, which is not easily damaged and has a long service life.
  • CONVENIENT TO USE: Universal BGA stencil template has a compact appearance and is easy to carry around and use.


Specification:
Item Type: BGAReballingStencil
Pitch: 0.3mm/0.012in, 0.35mm/0.014in, 0.4/0.016in, 0.5mm/0.020in
Product Material: Stainless Steel
How to Use:
Usedirectly
Package List:
1 x BGA Reballing Stencil


Tho Nguyen
Reviewed in the United States on April 5, 2023
Work perfectly for Apple faceID chip transfer.
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